|
Press Releases and News |
| May 2007 |
SIX SIGMA Solder
Column Technology used in CFEsat |
| August 2005 |
Microelectronics Technical Briefs
from SIX SIGMA, Vol I, Iss 1 |
| December 2004 |
SIX SIGMA announces Defense Supply Center Columbus
(DSCC) commercial laboratory suitability status, MIL-STD-883, FSC 5962 |
| June 2002 |
SIX SIGMA opens its New Home in Milpitas, California |
| September 1998 |
SIX SIGMA announces
Column Attach Services For Ruggedizing Commercial Off The Shelf (COTS) Components
Daryl Sawtelle, Six Sigma, San Jose, CA |
| July 1998 |
SIX SIGMA Announces Volume Ball Attach Service Utilizing
RVSI/Vanguard BGA Ball Placement System
Daryl Sawtelle, Six Sigma, San Jose, CA |
| February 1996 |
Winslow Automation Acquires The Rights To SolderQuik®
Product Line From Raychem
Winslow Automation, San Jose, CA |
|
Technical Papers |
| October 2006 |
CCGA Board Level Testing Report
(External; PDF) |
| May 2005 |
Converting BGA Components to CGA
(PDF)
presented at Military Aerospace, Space and Homeland Security: Packaging
Issues & applications workshop (MASH 2005) |
| March 2001 |
Column Grid Array: A Modified COTS Approach for Area Array Packaging of
Military and Space Electronics
(5MB, PDF) presented at
commercialization of Military & Space Electronics (CMSE 2001) Conference |
|
Articles |
| May 2007 |
Experimental Satellite Integrates SIX SIGMA
CGA
From SMT (External)
From Advance Packaging (External) |
| June 1998 |
Preform Method
Simplifies Small Volume BGA Ball Attach/Reattach
(PDF) |
|
White Papers and Presentations |
| November
2006 |
Actel CCGA Board Level Testing Report (PDF, External) |
| October 2006 |
Aeroflex Colorado Springs Solder Column Qualification for Ceramic Column
Grid Array (CCGA) (PDF, External) |
| October 2006 |
Hot Solder Dip and Minimizing Thermal Gradients
(PDF) |
| March 2006 |
BGA Reballing for Military & Aerospace
Applications Poster
(JPG) |
| November 2005 |
Converting Ball Grid Array to Column Grid Array
Poster
(JPG)
|
| September 2004 |
Tin Whiskers
Dale Albright, Sales and Marketing, Milpitas, CA |
| September 1998 |
BGA
Reballing Services Information
Chad Hyatt, Six Sigma, San Jose, CA |
|
Other Interesting
Articles |
| August 2006 |
"Could
RoHS mean the end of COTS as we know it?" (External)
Military & Aerospace Electronics |
|
Lead Free Articles |
| May 2006 |
"Get
the Lead Out" (External)
WORLD Magazine |
| October 2005 |
"Lead-free
solder: A train wreck in the making"
(External)
Military & Aerospace Electronics |
| August 2005 |
“Aerospace
Industry Transition to Lead-Free Electronics”
(External)
Boeing Environmental Technotes |
|
Tin Whisker |
| October 2007 |
"Tin Whiskers" imperil electronics
(External) |
| April 2006 |
Tin Whiskers: A History of Documented Failures
(External)
NASA |
| September
2005 |
“Reactor
Shutdown: Dominion Learns Big Lesson From A Tiny ‘tin Whisker, TheDay,
April 2005” (External)
Office of Nuclear Reactor Regulation (NRR) |
| August 2005 |
“Serious
Doubts Among Engineers on Tin Whisker Testing”
(External)
Design News |
| January 2005 |
“Tin
Whiskers: The Next Y2K problems?”
(External)
MoneyCNN.com |
| |
NASA’s information on
Tin Whiskers (External)
NASA |
|
Tin Pest |
| August 2005 |
“Tin
Pest: Still a Forgotten Concern in Lead Free Assembly”
(External)
Indium |
| November
2004 |
“Napoleon's
Buttons and Lead-free Soldering”
(External)
Advanced Packaging, Lead-free Electronics |
