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Your expert in Robotic Hot Solder Dip (HSD), Column Attach,
Ball Grid Array (BGA) to Column Grid Array (CGA) conversions, Ball Attach,
BGA Reballing, and Trim & Form. Also Failure Analysis, Bond Pull,
Mark Permanency, Ball Shear, XRF, Solderability, and Fine & Gross Leak
Testing.
For over 23 Years, SIX SIGMA has
been advancing lead finish and soldering technology for the military,
aerospace, and commercial micro-electronics component industry.
SIX SIGMA is the technical leader and subcontractor of choice for the
alteration and testing of micro-electronic components to increase reliability,
mitigate tin whiskers, or achieve RoHS compliance.
Our team of experienced semiconductor assembly engineers
is committed to obtaining component lead finish excellence through the
development of innovative manufacturing processes and solutions.
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Our Featured Service
Check Out Our Certifications!
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News September 16, 2011 Press Release: Six Sigma Achieves AS9100 Rev C Certification
Mike Mazdeh, San Jose, CA February 2011 Ceramic Column Grid Array Design and Manufacturing Rules for Flight Hardware
Goddard Technical Standard October 29, 2009 SIX SIGMA Achieves AS9100 and ISO9001:2008 Certification
Dale Albright, Milpitas, CA
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