Microelectronic Component Specialist

AS9100C and ISO 9001:2008 Certified

Your expert in Robotic Hot Solder Dip (HSD), Column Attach, Ball Grid Array (BGA) to Column Grid Array (CGA) conversions, Ball Attach, BGA Reballing, and Trim & Form.  Also Failure Analysis, Bond Pull, Mark Permanency, Ball Shear, XRF, Solderability, and Fine & Gross Leak Testing.

For over 26 Years, SIX SIGMA has been advancing lead finish and soldering technology for the military, aerospace, and commercial micro-electronics component industry.  SIX SIGMA is the technical leader and subcontractor of choice for the alteration and testing of micro-electronic components to increase reliability, mitigate tin whiskers, or achieve RoHS compliance.

Our team of experienced semiconductor assembly engineers is committed to obtaining component lead finish excellence through the development of innovative manufacturing processes and solutions.

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News

September 16, 2011

Press Release: Six Sigma Achieves AS9100 Rev C Certification
Mike Mazdeh, San Jose, CA

February 2011

Ceramic Column Grid Array Design and Manufacturing Rules for Flight Hardware (PDF)
Goddard Technical Standard

October 29, 2009

SIX SIGMA Achieves AS9100 and ISO 9001:2008 Certification
Dale Albright, Milpitas, CA

October 29, 2009

Winslow Automation Achieves AS9100 and ISO 9001:2008 Certification
Dale Albright, Milpitas, CA

November 13, 2008

SIX SIGMA Achieves Transitional QML Certification
Dale Albright, Milpitas, CA

October 21, 2008

SIX SIGMA Achieves AS9100 and ISO 9001:2000 Certification
Dale Albright, Milpitas, CA

October 2007

"Tin Whiskers" imperil electronics (PDF)