Your expert in Robotic Hot Solder Dip (HSD), Column Attach, Ball Grid Array (BGA) to Column Grid Array (CGA) conversions, Ball Attach, BGA Reballing, and Trim & Form.  Also Failure Analysis, Bond Pull, Mark Permanency, Ball Shear, XRF, Solderability, and Fine & Gross Leak Testing.

For over 19 Years, SIX SIGMA has been advancing lead finish and soldering technology for the military, aerospace, and commercial micro-electronics component industry.  SIX SIGMA is the technical leader and subcontractor of choice for the alteration and testing of micro-electronic components to increase reliability, mitigate tin whiskers, or achieve RoHS compliance.

Our team of experienced semiconductor assembly engineers is committed to obtaining component lead finish excellence through the development of innovative manufacturing processes and solutions.

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News

November 2008

Press Release: SIX SIGMA Achieves Transitional QML Certification

October 2008

Press Release: SIX SIGMA Achieves AS9100 and ISO9001:2000 Certification

May 2007

Press Release: SIX SIGMA Solder Column Technology used in CFEsat
Article from SMT  (External)
Article from Advance Packaging (External)