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Other Testing Services
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Ball Shear Testing
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This test is conducted to determine
the ability of Ball Grid Array (BGA) solder balls to withstand mechanical shear
forces that may be applied during BGA manufacturing and handling operations.
In addition Ball Shear Testing is a valuable process monitor to determine
the reliability of the ball attach. It is a
destructive test. It can be performed at anytime prior to second level attachment to
the printed wiring board or stress testing of the BGA module.
During the ball shear test, balls
are sheared individually. The loading rate, the maximum load, and failure mode
of each sheared solder ball are collected
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Applicable Specifications & Standards:
JEDEC JESD22-B117, BGA Ball Shear
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Column Pull Testing
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Column Pull Testing is performed
to determine the strength of the attached column interconnects and the corresponding
failure mode. This method yields quantifiable data pertaining to the quality
and consistency of the solder column, fillet, and pad. Column pull is a destructive
test.
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Lead Fatigue Testing
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Lead Fatigue Testing is designed
to check the resistance of the leads to metal fatigue. The equipment requires
attaching devices, clamps, supports, or other suitable hardware necessary to
apply a repeated bending stress on the lead throughout the specified bend angle.
The applied load, bend angle, and number of cycles required depend upon the
package type. Any device that exhibits evidence of breakage, loosening, or relative
motion between the terminal lead and the device body when stress is removed
is considered a device failure.
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Applicable Specifications & Standards:
JESD22-B105, Lead Integrity Test
MIL-STD-883 Method 2004, Lead Integrity
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Mark Permanency Testing
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Mark Permanency Testing is needed
to verify that the component markings remain legible when subjected to repeated
cleaning with common solvents. It also verifies that the solvents will not cause
deterioration of the materials or finishes. The process is performed by subjecting
the components to repeated soaking and brushing of various commonly-used solvents
in PCB assembly. In addition, gold-lidded devices are subjected to "pre-conditioning"
in heated RMA flux. After the test, the components are inspected for marking
failure or degradation of the package. This test is applicable for all
package types. However this procedure does not apply to laser-marked components.
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Fail |
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Applicable Specifications & Standards:
JEDEC JESD22-B107,
Marking Permanency
MIL-STD-883 Method 2015, Resistance to Solvents
MIL-STD-750 Method 1022, Resistance to Solvents
MIL-STD-202 Method 215, Resistance to Solvents
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Temperature Cycling
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Temperature Cycling is performed
to determine the ability of components to survive induced mechanical stresses
brought about by alternating high and low temperature extreme. These
stresses can cause changes in physical or electrical properties of the components.
SIX SIGMA’s temperature cycle
chamber is capable of –70 °C to 200 °C.
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Applicable Specifications & Standards:
JESD22-A104, Temperature Cycling
MIL-STD-883 Method 1010, Temperature Cycling
MIL-STD-750 Method 1051, Thermal Shock (temperature cycling)
MIL-STD-202 Method 107, Thermal Shock
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Temperature and Humidity
(Moisture
Resistance)
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Temperature and Humidity
(moisture resistance) testing is typically performed to evaluate, in an
accelerated manner, the resistance of components to the deleterious effects
of high-humidity and heat conditions. The test is commonly performed at
steady state temperature and humidity (such as 85C and 85% RH) for a
specified time. The test may also be performed while cycling the temperature
and/or humidity. In addition, bias testing can be performed by applying a
voltage to alternate pins on a component. Bias testing accelerates failure
mechanisms such as electro-chemical migration and conductive anodic
filaments that can cause electrical issues. Component degradation can be
detected by the measurement of changes in electrical characteristics.
SIX SIGMA’s Temperature and
Humidity chamber is also used for Moisture Sensitivity Level (MSL) testing
and tin whisker testing. |
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Applicable Specifications & Standards:
JEDEC JESD22-A100, Cycled Temperature-Humidity-Bias Life
Test
JEDEC
JESD22-A101, Steady State Temperature Humidity Bias Life Test
MIL-STD-883 Method 1004, Moisture Resistance
MIL-STD-750 Method 1021, Moisture Resistance
MIL-STD-202 Method 106, Moisture Resistance
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