Microelectronic Component Specialist

AS9100D and ISO9001:2015 Certified
 
Other Testing Services
 
 
 
 

Ball Shear Testing

 
 

This destructive test is conducted to determine the ability of Ball Grid Array (BGA) solder balls to withstand mechanical shear forces that may be applied during BGA manufacturing and handling operations.  In addition, Ball Shear Testing is a valuable process'  monitor to determine the reliability of the ball attach.    It can be performed at anytime prior to second level attachment to the printed wiring board or stress testing of the BGA module.

During the ball shear test, balls are sheared individually. The loading rate, the maximum load, and failure mode of each sheared solder ball are collected

 

 

 
 
Applicable Specifications & Standards:
 
 

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Column Pull Testing

 
 

Column Pull Testing is performed to determine the strength of the attached column interconnects and the corresponding failure mode. This method yields quantifiable data pertaining to the quality and consistency of the solder column, fillet, and pad. Column pull is a destructive test.

   
 

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Lead Fatigue Testing

 
 

Lead Fatigue Testing is designed to check the resistance of the leads to metal fatigue. The equipment requires attaching devices, clamps, supports, or other suitable hardware necessary to apply a repeated bending stress on the lead throughout the specified bend angle. The applied load, bend angle, and number of cycles required depend upon the package type. Any device that exhibits evidence of breakage, loosening, or relative motion between the terminal lead and the device body when stress is removed is considered a device failure.

   
 
Applicable Specifications & Standards:
 
 

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Mark Permanency Testing

 
 

Mark Permanency Testing is needed to verify that the component markings remain legible when subjected to repeated cleaning with common solvents. It also verifies that the solvents will not cause deterioration of the materials or finishes. The process is performed by subjecting the components to repeated soaking and brushing of various commonly-used solvents in PCB assembly. In addition, gold-lidded devices are subjected to "pre-conditioning" in heated RMA flux. After the test, the components are inspected for marking failure or degradation of the package.  This test is applicable for all package types but does not apply to laser-marked components.

 

Pass

Fail

 
 
Applicable Specifications & Standards:
 
 

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