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Articles:
Technical Briefs Home
The President's Corner
Molding Compound Lawsuit Quietly
Settled
Lead-Free and the Military / Aerospace
Dilemma
GEIA Hot Solder Dip Specification
Ionic Contamination at the Component
Level
Column Grid Array: The Solution
to BGA Reliability Problems
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Articles
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With blinding speed, the semiconductor
industry is adopting pure-tin as the primary finish for all components
except ball grid array. To them, pure-tin is ideal…
[Read
More]
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Recently, a $125 million out-of-court settlement was reached between Fujitsu
Limited, Cirrus Logic, Amkor Technologies and Sumitomo Bakelite Co. This case
revolved around the use of elemental (red) phosphorus…[Read
More]
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The RoHS directive has succeeded in driving semiconductor and electronics
companies to qualify and adopt lead-free solders. The dilemma for Military
and Aerospace is that they will be forced into using components and processes
which are unproven and in certain situations known to be less reliable.
Even though Military and Aerospace users are exempt from RoHS, the availability
of tin-lead components… [Read More]
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Tin Whiskers [1]
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The G-12 Committee of the Government Electronics and Information Technology
Association (GEIA) has agreed to Six Sigma’s proposal…[Read
More]
Standards exist for ionic cleanliness and contamination
testing at the electronic board assembly level, but currently none have been
established for the component level. Ionic contamination degrades the reliability
of electronic components as it…[Read
More]
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Six Sigma Columns on IBM PowerPC
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Area array packaging technology has taken the electronics industry
by storm. Ball Grid Array (BGA) components provide a huge increase in
available interconnects without the troubles associated with bent leads.
However, these wonderful new components bring with them serious issues…[Read
More]
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