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GEIA Hot Solder Dip Specification
Ionic Contamination at the Component
Column Grid Array: The Solution
to BGA Reliability Problems
Column Grid Array: The Solution to BGA Reliability Problems
Area array packaging technology has taken the electronics industry by storm.
Ball Grid Array (BGA) components provide a huge increase in available
interconnects without the troubles associated with bent leads. However, these
wonderful new components bring with them serious issues related to board-level
reliability at extreme temperatures as seen in industrial, military, and space
environments. Column Grid Array (CGA) is the solution to these problems.
In this year’s Military, Aerospace, Space, and Homeland Security (MASH):
Packaging Issues & Applications Workshop, Six Sigma presented a paper on the
conversion of BGA components to CGA. In the paper, data was presented which
demonstrates the considerable reliability improvements when using solder
columns. In addition, the significant advantages of the reinforced solder
columns were also presented.
For the full text of the MASH 2005 Technical paper:
Converting Ball Grid
Array Components to Column Grid Array
For more information on CGA:
Six Sigma is actively involved in BGA to CGA conversions for high-reliability
applications. Six Sigma, with its history of providing services for the
semiconductor industry for over 15 years, has proven to be the leader in the
field of hot solder dip,
BGA reballing and
column attach services.
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