FOR IMMEDIATE RELEASE
Chief Financial Officer
SIX SIGMA ANNOUNCES COLUMN ATTACH SERVICES FOR RUGGEDIZING COMMERCIAL OFF THE
SHELF (COTS) COMPONENTS
San Jose, CA -
September 1, 1998 - SIX SIGMA announced today that it now provides solder column attach services for
the ruggedization of Commercial Off The Shelf (COTS) components using patented SolderQuik
The columns resolve solder joint reliability issues between Ceramic Ball Grid Array
(CBGA) components and organic boards which are caused by Coefficient of Thermal
Expansion (CTE) mismatch. SIX SIGMA uses unique columns composed of a copper ribbon
wrapped around a high lead core. Each column is mounted to the component using a
precisely controlled volume of eutectic solder. The columns serve as a compliant
interconnect thus reducing solder joint fatigue in extreme thermal cycle environments.
This allows a board assembly to withstand significantly more temperature cycles
than a similar assembly using high lead solder balls.
SIX SIGMA has recently begun attaching these solder columns to Power PC chips for
application in extremely harsh environments. Similar column technology has been
in use for well over a decade to make Ceramic Leadless Chip Carriers (LCCs) suitable
for military (-55 to +125°C) applications. Many successful studies have demonstrated
high reliability in extreme environments for LCCs with columns attached.
SIX SIGMA, which began operations in 1990, provides hot solder lead finish services
and related testing for the semiconductor and printed circuit board industries.
Components processed by SIX SIGMA are in applications that vary from the most sophisticated
missile guidance systems, to the engine controllers in commercial airlines, to automobile
passive restraint systems. Today, SIX SIGMA is a recognized leader in semiconductor
lead finish, processing millions of high reliability semiconductor components each
year, and an emerging leader in BGA repair and ball attach solutions.