SIX SIGMA ANNOUNCES COLUMN ATTACH SERVICES FOR RUGGEDIZING COMMERCIAL OFF THE SHELF (COTS) COMPONENTS

For Release
September 1, 1998

San Jose, CA

SIX SIGMA announced today that it now provides solder column attach services for the ruggedization of Commercial Off The Shelf (COTS) components using patented SolderQuik ^™ technology.

The columns resolve solder joint reliability issues between Ceramic Ball Grid Array (CBGA) components and organic boards which are caused by Coefficient of Thermal Expansion (CTE) mismatch. SIX SIGMA uses unique columns composed of a copper ribbon wrapped around a high lead core. Each column is mounted to the component using a precisely controlled volume of eutectic solder. The columns serve as a compliant interconnect thus reducing solder joint fatigue in extreme thermal cycle environments. This allows a board assembly to withstand significantly more temperature cycles than a similar assembly using high lead solder balls.

SIX SIGMA has recently begun attaching these solder columns to Power PC chips for application in extremely harsh environments. Similar column technology has been in use for well over a decade to make Ceramic Leadless Chip Carriers (LCCs) suitable for military (-55 to +125°C) applications. Many successful studies have demonstrated high reliability in extreme environments for LCCs with columns attached.

SIX SIGMA, which began operations in 1990, provides hot solder lead finish services and related testing for the semiconductor and printed circuit board industries. Components processed by SIX SIGMA are in applications that vary from the most sophisticated missile guidance systems, to the engine controllers in commercial airlines, to automobile passive restraint systems. Today, SIX SIGMA is a recognized leader in semiconductor lead finish, processing millions of high reliability semiconductor components each year, and an emerging leader in BGA repair and ball attach solutions.

Contact:
Daryl Sawtelle
Chief Financial Officer
SIX SIGMA