FOR IMMEDIATE RELEASE
WINSLOW AUTOMATION, INC.
AWARDED 1998 SMT VISION AWARDS REWORK & REPAIR PRODUCT OF THE YEAR FOR SolderQuik® BGA PREFORM
WINSLOW AUTOMATION, INC., announces today that their SolderQuik®
Ball Grid Array Preform has been recognized by Surface Mount Technology magazine as the
1998 Vision Award Rework and Repair Product of the Year. SMT Vision Awards recognize the people
and products within the surface mount industry that serve as benchmarks of excellence.
The SolderQuik® BGA Preform provides a unique BGA reballing
solution. The SolderQuik® BGA Preform consists of an array of
solder spheres embedded in a water soluble paper/polymer carrier. The beauty of the
preform process lies in its simplicity. After applying flux, simply align the component to
the preform with an inexpensive fixture. After reflow, just moisten the carrier and peel
it off. SolderQuik® Preforms eliminate the need for stencils,
loose solder balls, and solder paste in the reballing process. Reballing a component with
preforms requires only a few seconds of labor and very little operator skill, which
translates to throughput improvements. This process works well with most reflow equipment
and alongside any rework station. Preforms are currently available in over 160 array
patterns, including various ball sizes and center cut designs (for cavity down
components). Our pattern database grows daily to meet customer demand.
WINSLOW AUTOMATION, INC. has been advancing lead finish and soldering technology since
1986. In 1990, Winslow Automation expanded to include a service division known as S·I·X
S·I·G·M·A, utilizing the Winslow Automation FlexLine® , a computerized
robotic lead tinning machine capable of processing a variety of components. S·I·X
S·I·G·M·A has become the premier lead finish subcontractor in the nation processing
millions of components annually. In 1994, Winslow Automation expanded its soldering
equipment line with the asset purchase of Mechanization Associates. In 1996, Winslow
Automation acquired Raychem Corporation's SolderQuik® Products
as a natural extension to our soldering technology product base. We reengineered the
SolderQuik® BGA Preform, and first began to market it at NEPCON
West in March, 1998. S·I·X S·I·G·M·A added BGA reballing services utilizing the
SolderQuik ® technology in 1997 and has since processed
thousands of BGA components.