|
Column Grid Array (CGA) is the
ultimate solution to thermal cycle reliability limitations common in commercial
Ball Grid Array (BGA) packages. Differences in coefficients of thermal expansion
and differential temperatures between component and board can cause significant
stresses in typical BGA solder joints. By replacing rigid solder balls with
SIX SIGMA's patented solder columns, significant
improvements in thermal cycle reliability (on the order of
600 to 800 percent)
can be achieved.
Originally developed by
Raychem Corporation, SIX SIGMA's copper reinforced solder column has become the standard
of choice in high reliability, military, and space applications. Due to their
innovative construction, SIX SIGMA columns are very ductile which helps them
to absorb the solder joint stress. In addition, the reinforced solder
column out performs the commercial straight wire column. In a straight wire
column, a crack quickly propagates causing an electrical open. However, with
SIX SIGMA's unique construction the electrical open is abated by the redundant connection
created by the copper ribbon.
In service in harsh environment
applications for over 20 years, this proven technology is your answer to ruggedizing
commercial-off-the-shelf (COTS) components to meet your high reliability, military,
or aerospace needs.
Why
convert from BGA to CGA?
Poster: Converting BGA Components to CGA
(JPG)
CGA Technical Papers
Brochure: Column Attach Services
(PDF)
Actel CCGA Board Level Testing Report (PDF, External)
|
