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Column Grid Array (CGA) is the ultimate solution to thermal
cycle reliability limitations common in commercial Ball Grid Array (BGA) packages.
Differences in coefficients of thermal expansion and differential temperatures
between component and board can cause significant stresses in typical BGA solder
joints. By replacing rigid solder balls with SIX SIGMA's patented solder columns,
significant improvements in thermal cycle reliability (on the order of
600 to 800 percent) can be achieved.
Originally developed by
Raychem Corporation,
SIX SIGMA's copper-reinforced solder column has become the standard of choice
in high reliability, military, and space applications. Due to their innovative
construction, SIX SIGMA columns are very ductile which helps them to absorb
the solder joint stress. In addition, the reinforced solder column out-performs
the commercial straight wire column. In a straight wire column, a crack quickly
propagates, causing an electrical open. However, with SIX SIGMA's unique construction
the electrical open is abated by the redundant connection created by the copper
ribbon.
In service in harsh environment applications for over 20 years,
this proven technology is your answer to ruggedizing commercial-off-the-shelf
(COTS) components to meet your high reliability, military, or aerospace needs.
Why convert from BGA to CGA?
Poster:
Converting BGA Components to CGA
CGA Technical Papers
Brochure: Column Attach
Services
Actel CCGA Board Level Testing Report
Reinforced Column Grid
Array - Actel Space Forum
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