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Backend Services
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Tape and Reel
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Tape and reel is the process
of sealing components into a carrier tape for transport and storage. The tape
is embossed (vacuum-formed) to safely hold most types of components. Many of
the PCB assembly machines are tooled to automatically remove the component from
the tape and place them on the PCB for final assembly. This eliminates any manual
handling during PCB assembly and thus, provides a very efficient and safe method
of handling.
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Applicable Specifications & Standards:
EIA-481, 8 mm through 200 mm Embossed Carrier
Taping and 8 mm & 12 mm Punched Carrier Taping of Surface Mount Components for
Automatic Handling
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Trim and Form
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SIX SIGMA has specialized expertise in trim and form of hermetic glass-sealed components. Trim and Form is the process
of cutting and forming the leads of the component. At SIX SIGMA, components
are typically received in flat-pack format after electrical test then are trimmed
and formed prior to hot solder dip (HSD). The HSD process removes the gold finish
which would otherwise cause embrittlement of the solder joint.
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Bake and Dry Pack
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SIX SIGMA offers Bake and Dry
Pack to eliminate the moisture that can damage the components. The process is
performed by baking the components at specified temperatures and times to remove
moisture. The components are then vacuum packed in a special moisture-resistant
bag. This process is strongly recommended for any plastic component that would
absorb moisture, as it is stored, thus minimizing any delamination issues when
mounting the component to the PC Board. This allows the components to be stored
in normal room conditions.
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Applicable Specifications & Standards:
IPC/JEDEC J-STD-033, Handling, Packing, Shipping
and Use of Moisture/Reflow Sensitive Surface Mount Devices
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Physical Dimension Verification
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SIX SIGMA utilizes the toolmaker’s
microscope, the optical comparator, and other high-resolution instruments (calibrated
and traceable to NIST standards) to verify that the component’s external physical
dimensions are in conformance with the pertinent procurement document. These
instruments are employed for this non-destructive test, and can be used to evaluate
lot acceptance, process monitor, and qualification.
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Applicable Specifications & Standards:
JEDEC JESD22-B100, Physical Dimensions
MIL-STD-883 Method 2016, Physical Dimensions
MIL-STD-750 Method 2066, Physical Dimensions
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Lead Scan & Conditioning
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Scanning is the process of
measuring the true position of
surface mount package leads for adherence to specification.
Conditioning is the process of repairing leads which are out of
tolerance.
SIX SIGMA utilizes Scanner Technologies
Lead Scanner to provide the highest accuracy in inspecting fine-pitch
lead systems. All measurement accuracies exceed three-sigma regardless of device
size. Each device to be inspected is automatically placed “live bug” on a
glass
reticle which
defines the true seating plane. Errors caused by in-tray scanning are avoided which results in the highest accuracy coplanarity measurement
possible.
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Applicable Specifications & Standards:
JEP 95, Design Requirements for Outlines of Solid
State and Related Products
JESD22-B108, Coplanarity Test for Surface Mount Semiconductor Devices
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